China Automotive Cockpit Domain Controller Research Report 2025: Three Architectures Driving AI-Enabled Intelligent Cockpit Transformation
The automotive cockpit has entered a period of profound transformation. Once characterized by the layering of functions—such as infotainment, navigation, and instrument clusters—the cockpit is now becoming a deeply integrated, AI-driven environment. This shift is powered by rapid advances in hardware computing power, the evolution of E/E architectures toward centralization, and the growing application of large-scale AI models in vehicles.
The “Automotive Cockpit Domain Controller Research Report, 2025”, recently added to ResearchAndMarkets.com’s offering, provides an in-depth analysis of these trends. It highlights the three core architectures shaping cockpit domain controller development in China:
- High-computing power single-chip AI domain controllers
- Dual-chip architectures
- Cockpit domain controller + AI coprocessor (AI BOX) solutions
Each of these approaches is driving the intelligent cockpit toward a future where immersive, interactive, and personalized experiences will be standard features in vehicles.
1. The Rise of High-Computing Power Single-Chip Cockpit Domain Controllers
At the forefront of cockpit transformation is the deployment of single high-performance SoCs (system-on-chips) that can handle increasingly complex AI workloads. The demand is driven by applications such as 3D human-machine interfaces (HMI), in-car gaming, cross-screen interaction, immersive infotainment, and the convergence of smart cockpits with intelligent driving systems.
To support these applications, SoCs must deliver massive computing power, wide memory bandwidth, and ultra-fast communication speeds. Industry data shows that:
- Current mainstream high-end cockpit SoCs already achieve 200+ KDMIPS CPU computing power.
- Next-generation solutions are reaching 600+ KDMIPS.
- Cockpit AI performance in mass production vehicles stands around 60 TOPS today, but upcoming domain controllers promise 360 TOPS, 400 TOPS, and even 720 TOPS.
These advancements ensure that AI large models can run efficiently on the vehicle side without relying heavily on cloud connectivity.
Example Deployments in 2025
- PATEO & Qualcomm: In April 2025, PATEO deepened its collaboration with Qualcomm Technologies, integrating the Snapdragon Cockpit Platform Elite (QAM8397P) into a new generation of cockpit solutions. This solution combines Qualcomm’s GPU/NPU computing with PATEO’s software expertise, delivering high-definition graphics, real-time AI responses, and scalable architectures. Already, a leading Chinese automaker has designated this platform for mass production.
- SemiDrive X10 Series: SemiDrive launched its X10 series AI cockpit chips, integrating 40 TOPS NPU computing power and 154 GB/s memory bandwidth. The X10 enables the deployment of 7-billion-parameter multimodal AI models on-device, reducing latency issues. Through collaborations with companies like FaceWall Intelligence and Banma Intelligent Driving, SemiDrive is building a stronger ecosystem to accelerate in-car AI adoption. Tier-1 suppliers such as Desay SV are leveraging the X10 for next-generation cockpit platforms that promise safer, more personalized, and more efficient experiences.
2. Dual-Chip Cockpit Domain Controller Architectures
While single-chip solutions dominate discussions, some OEMs are opting for dual-SoC cockpit controllers to ensure redundancy, stability, and low latency. By connecting two chips via high-speed interconnects and allocating computing resources intelligently, automakers can build highly resilient cockpits capable of supporting advanced AI models and multimodal interactions.
Case Study: Lynk & Co 900 (2025)
The Lynk & Co 900, launched in 2025, features a dual Qualcomm Snapdragon 8295 setup. This architecture powers:
- 30-inch 6K integrated main screen
- 30-inch 6K floating rear entertainment display
- 95-inch AR-HUD with 3D visualization
- Cross-screen gesture controls
- Immersive surround sound systems
- AI “smart butler” for emotional interaction
By adopting dual chips, Lynk & Co ensures high bandwidth and low latency across its cockpit ecosystem, delivering an unmatched user experience.
Other OEMs have deployed dual Snapdragon 8155 or dual SiEngine Longying No.1 controllers, showing that this layout is a popular bridge between traditional cockpits and the fully integrated AI-driven architectures of the future.
3. Cockpit Domain Controller + AI Coprocessor (AI BOX) Solutions
Even as chip performance grows, the computing power gap remains a challenge. Running large AI models on-device without cloud dependency requires enormous resources. To address this, companies are experimenting with AI BOX solutions that augment existing cockpit controllers.
This approach allows automakers to integrate AI capabilities without redesigning the entire vehicle architecture, making AI cockpits more accessible (“AI cockpit equality”).
Example: Aptiv’s AI BOX at the 2025 Shanghai Auto Show
Aptiv showcased an AI cockpit where the primary SoC handled standard cockpit functions, while an AI coprocessor boosted computing power for large AI models. This setup combined on-device multimodal models with cloud-based AI, offering a flexible, scalable, and cost-effective solution.
4. Evolution Toward Multi-Domain Integration
The cockpit domain controller is no longer limited to infotainment and displays. With the evolution of E/E architectures toward centralization, OEMs and suppliers are rapidly advancing toward cross-domain integration—merging cockpit, parking, connectivity, and intelligent driving functions into unified controllers.
Cockpit-Parking Integration
- Driven by cost reduction and the spread of smart vehicle functions.
- Based largely on Qualcomm 8155/8255, SemiDrive X9SP, and SiEngine Longying No.1 chips.
- SemiDrive X9SP integrates cockpit functions (infotainment, voice, HMI) with parking functions (APA, surround view, DMS) into a single platform.
The Chery Tiggo 7 High Energy Edition, launched in June 2025, adopted the SemiDrive X9SP, supporting high-reliability digital instruments and a 13.2-inch AI display.
Cockpit-Driving Integration
- In 2024, 438,600 cockpit-driving integrated domain controllers were installed in Chinese passenger cars, across more than 20 models.
- Common configurations: Qualcomm 8295/8155 for cockpit + Nvidia Orin-X for driving.
- Brands such as Xpeng, NIO, Leapmotor, Voyah, Xiaomi, and Li Auto already deploy these solutions.
Looking ahead, single-SOC solutions are on the horizon. Chips such as Qualcomm Ride Flex SA8775P, NVIDIA Thor, and Black Sesame C1296 promise to handle cockpit and driving functions together, with mass production expected in 2025.
5. Market Outlook and OEM Strategies
The report provides detailed forecasts on:
- Market size (2024–2030E)
- Penetration rates by type
- OEM adoption strategies
Leading Chinese OEMs such as BYD, Geely, Great Wall, Changan, SAIC, FAW, Dongfeng, and Chery are aggressively investing in cockpit domain controllers. EV startups including Xpeng, NIO, Li Auto, Leapmotor, and Xiaomi Auto are pioneering multi-domain integration and AI-driven cockpits. Foreign players like Tesla, Mercedes-Benz, BMW, and Volkswagen are also active in China’s cockpit domain controller market.
On the Tier-1 and semiconductor side, companies like Qualcomm, NVIDIA, Huawei, SemiDrive, SiEngine, Black Sesame Intelligence, MediaTek, Horizon Robotics, and Desay SV are driving innovation across SoCs, AI BOXes, and integration platforms.
The AI Cockpit Era Is Here
By 2025, the cockpit domain controller is no longer just an ECU—it has become the nerve center of the intelligent vehicle. Three architectures—high-computing single chips, dual-chip systems, and AI BOX-enhanced solutions—are enabling the transition from function superposition to AI empowerment.
As multi-domain integration accelerates and computing platforms reach new heights, the automotive cockpit is evolving into a personalized, immersive, and AI-native space. For OEMs and suppliers, success in this domain will define competitiveness in the next decade of mobility.
