indie Semiconductor (Nasdaq: INDI) has unveiled the iND87204, its latest advanced automotive wireless charging system-on-chip (SoC). This new SoC is fully compliant with the Wireless Power Consortium’s (WPC) Qi 2.0 standard and supports the Magnetic Power Profile (MPP) feature, known as “Qi2,” which enhances the charging experience by aligning devices magnetically with the inductive charger coils for more efficient, reliable, and convenient charging. The iND87204 integrates multiple Arm® Cortex® processors for both application and WPC stack processing, along with essential in-vehicle serial interfaces, power management, DC-DC conversion, signal conditioning, WPC inverter drivers, power FETs, and peripheral drivers, delivering up to 15 watts of power.
As wireless charging becomes more common in portable devices like smartphones, tablets, and laptops, the demand for in-vehicle wireless charging is growing. The MPP capability of the latest WPC standard enhances charging reliability by keeping devices optimally positioned despite vehicle movement. The global in-car automotive wireless charger market, valued at $1.9 billion in 2024, is projected to reach $13.6 billion by 2034, growing at a 21.9% CAGR.
Fred Jarrar, Vice President and General Manager of indie Semiconductor’s Power and ASIC Business Unit, stated, “With increasing demand for seamless, rapid, and reliable in-vehicle charging, the iND87204 builds on the success of our first-generation iND87200. It offers the highest component integration for a Qi2 MPP-compliant SoC, reducing the implementation footprint and external bill-of-materials by up to 50% compared to existing solutions. The iND87204’s advanced integration and turn-key firmware designs accelerate time to market and reduce development risks, promoting wider OEM adoption of Qi2-based automotive charging and enhancing the in-cabin experience for consumers.”
